AWT6113

Features:

• InGaP HBT Technology
• High Efficiency: 38%
• Low Quiescent Current: 44 mA
• Low Leakage Current in Shutdown Mode: <1 A
• Optimized for a 50 System
• Low Profile Surface Mount Package: 1.56mm max
• CDMA 1XRTT Compliant
• CDMA 1xEV-DO Compliant


Application

• PCS CDMA Wireless Handsets
• Dual Band CDMA Wireless Handsets


Pinout





Specifications

PARAMETER	MIN	MAX	UNIT
Supply Voltage (VCC )	0	+5	V
Mode Control Voltage (VMODE)	0	+3.5	V
Reference Voltage (VREF)	0	+3.5	V
RF Input Power (PIN)	-	+10	dBm
Storage Temperature (TSTG)	-40	+150

Description

The AWT6113 is a high power, high efficiency amplifier module for PCS/CDMA wireless handset applications. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, serve to increase handset talk and standby time. The self-contained 4mm x 4mm surface mount package incorporates matching networks optimized for output power, efficiency and linearity in a 50 system.