AWT6106

Features: • InGaP HBT Technology• High Efficiency (37% Typical)• Low Leakage Current (5A)• SMT Module Package• Small Foot Print (6mm x 6mm)• Low Profile (1.5mm)• 50 Input and Output Matching• Low Quiescent Current (Icq = 63 mA)• Shut Down &...

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AWT6106 Picture
SeekIC No. : 004292250 Detail

AWT6106: Features: • InGaP HBT Technology• High Efficiency (37% Typical)• Low Leakage Current (5A)• SMT Module Package• Small Foot Print (6mm x 6mm)• Low Profile (1.5mm)&#...

floor Price/Ceiling Price

Part Number:
AWT6106
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/12/26

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Product Details

Description



Features:

• InGaP HBT Technology
• High Efficiency (37% Typical)
• Low Leakage Current (5A)
• SMT Module Package
• Small Foot Print (6mm x 6mm)
• Low Profile (1.5mm)
• 50 Input and Output Matching
• Low Quiescent Current (Icq = 63 mA)
• Shut Down & Mode Control
• CDMA 2000 IXRTT Compliant



Application

• PCS CDMA handsets
• Dual Band CDMA



Specifications

PARAMETER MIN MAX UNIT
Supply Voltage (VCC ) 0 +5 V
VMOD Voltage (VMOD) 0 +3.5 V
Reference Voltage (VREF) 0 +3.5 V
RF Input Power (PIN) - +10 dBm
Storage Temperature (TSTG) -40 +150 °C



Description

The AWT6106 is a 3.5 V (3.0 V to 4.2 V) high power, high efficiency, three stage power amplifier module for Dual Mode CDMA/PCS wireless handsets. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. A low power quiescent current mode is digitally controlled to reduce power drain on the system battery. The 6mm x 6mm laminate package is self contained, incorporating 50 input and output matching networks optimized for output power, linearity, and efficiency.




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