ATS-59010-C1-R0

HEAT SINK 62MM X 52MM X 13MM

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SeekIC No. : 003444540 Detail

ATS-59010-C1-R0: HEAT SINK 62MM X 52MM X 13MM

floor Price/Ceiling Price

US $ 7.94~11.05 / Piece | Get Latest Price
Part Number:
ATS-59010-C1-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • Unit Price
  • $11.05
  • $8.79
  • $7.94
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Quick Details

Capacitance : 16.5 pF Series: maxiGRIP
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: Flip Chip Processors Attachment Method: Clip
Shape: Rectangular, Angled Fins Length: 2.441" (62.00mm)
Width: 2.047" (52.00mm) Diameter: -
Height Off Base (Height of Fin): 0.512" (13.00mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Attachment Method: Clip
Thermal Resistance @ Natural: -
Type: Top Mount
Manufacturer: Advanced Thermal Solutions Inc
Shape: Rectangular, Angled Fins
Series: maxiGRIP
Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 200 LFM
Package Cooled: Flip Chip Processors
Length: 2.441" (62.00mm)
Width: 2.047" (52.00mm)
Height Off Base (Height of Fin): 0.512" (13.00mm)


Parameters:

Technical/Catalog InformationATS-59010-C1-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodClip
Height0.51" (13mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.2°C/W @ 200 LFM
Outline62.00mm x 52.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 59010 C1 R0
ATS59010C1R0
ATS1375 ND
ATS1375ND
ATS1375



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