HEAT SINK 62MM X 52MM X 13MM
ATS-59010-C1-R0: HEAT SINK 62MM X 52MM X 13MM
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Capacitance : | 16.5 pF | Series: | maxiGRIP |
Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
Package Cooled: | Flip Chip Processors | Attachment Method: | Clip |
Shape: | Rectangular, Angled Fins | Length: | 2.441" (62.00mm) |
Width: | 2.047" (52.00mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.512" (13.00mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 3.2°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Technical/Catalog Information | ATS-59010-C1-R0 |
Vendor | Advanced Thermal Solutions Inc |
Category | Thermal Management |
Attachment Method | Clip |
Height | 0.51" (13mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 3.2°C/W @ 200 LFM |
Outline | 62.00mm x 52.00mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | ATS 59010 C1 R0 ATS59010C1R0 ATS1375 ND ATS1375ND ATS1375 |