ATS-59008-C2-R0

HEAT SINK 35MM X 46MM X 16MM

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SeekIC No. : 003444538 Detail

ATS-59008-C2-R0: HEAT SINK 35MM X 46MM X 16MM

floor Price/Ceiling Price

US $ 6.7~11.7 / Piece | Get Latest Price
Part Number:
ATS-59008-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • Unit Price
  • $11.7
  • $8.95
  • $7.58
  • $6.94
  • $6.7
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2025/3/14

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Product Details

Quick Details

Capacitance : 16.5 pF Series: maxiGRIP
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: Flip Chip Processors Attachment Method: Clip
Shape: Rectangular, Angled Fins Length: 1.378" (35.00mm)
Width: 1.811" (46.00mm) Diameter: -
Height Off Base (Height of Fin): 0.630" (16.00mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 2.4°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Attachment Method: Clip
Thermal Resistance @ Natural: -
Type: Top Mount
Length: 1.378" (35.00mm)
Manufacturer: Advanced Thermal Solutions Inc
Thermal Resistance @ Forced Air Flow: 2.4°C/W @ 200 LFM
Shape: Rectangular, Angled Fins
Series: maxiGRIP
Package Cooled: Flip Chip Processors
Width: 1.811" (46.00mm)
Height Off Base (Height of Fin): 0.630" (16.00mm)


Parameters:

Technical/Catalog InformationATS-59008-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryFans, Thermal Management
Attachment MethodClip
Height0.66" (16.75mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow2.42°C/W @ 200 LFM
Outline46.00mm x 35.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 59008 C2 R0
ATS59008C2R0
ATS1373 ND
ATS1373ND
ATS1373



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