ATS-59007-C2-R0, US $ 6.68-11.67, ATS-59007-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444537 Detail

ATS-59007-C2-R0: HEAT SINK 35MM X 46MM X 16MM

ATS-59007-C2-R0 Data Sheet

US $ 6.68~11.67 / Piece | Get Latest Price

Part Number:: ATS-59007-C2-R0
Mfg:
Supply Ability:: 5000

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$11.67
$8.93
$7.56
$6.92
$6.68

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Upload time: 2024/11/24

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	maxiGRIP
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	Flip Chip Processors	Attachment Method:	Clip
Shape:	Rectangular, Angled Fins	Length:	1.378" (35.00mm)
Width:	1.811" (46.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.630" (16.00mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	2.4°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Attachment Method: Clip
Thermal Resistance @ Natural: -
Type: Top Mount
Length: 1.378" (35.00mm)
Manufacturer: Advanced Thermal Solutions Inc
Thermal Resistance @ Forced Air Flow: 2.4°C/W @ 200 LFM
Shape: Rectangular, Angled Fins
Series: maxiGRIP
Package Cooled: Flip Chip Processors
Width: 1.811" (46.00mm)
Height Off Base (Height of Fin): 0.630" (16.00mm)

Parameters:

Technical/Catalog Information	ATS-59007-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Clip
Height	0.66" (16.75mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	2.42°C/W @ 200 LFM
Outline	46.00mm x 35.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 59007 C2 R0 ATS59007C2R0 ATS1372 ND ATS1372ND ATS1372

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ATS-59007-C2-R0

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