ATS-59005-C2-R0

HEAT SINK 29MM X 37MM X 10MM

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SeekIC No. : 003444535 Detail

ATS-59005-C2-R0: HEAT SINK 29MM X 37MM X 10MM

floor Price/Ceiling Price

US $ 8.41~13.82 / Piece | Get Latest Price
Part Number:
ATS-59005-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • Unit Price
  • $13.82
  • $10.99
  • $9.47
  • $8.7
  • $8.41
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Quick Details

Capacitance : 16.5 pF Series: maxiGRIP
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: Flip Chip Processors Attachment Method: Clip
Shape: Rectangular, Angled Fins Length: 1.142" (29.01mm)
Width: 1.457" (37.00mm) Diameter: -
Height Off Base (Height of Fin): 0.394" (10.00mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 6.2°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Attachment Method: Clip
Thermal Resistance @ Natural: -
Height Off Base (Height of Fin): 0.394" (10.00mm)
Type: Top Mount
Manufacturer: Advanced Thermal Solutions Inc
Length: 1.142" (29.01mm)
Thermal Resistance @ Forced Air Flow: 6.2°C/W @ 200 LFM
Shape: Rectangular, Angled Fins
Series: maxiGRIP
Package Cooled: Flip Chip Processors
Width: 1.457" (37.00mm)


Parameters:

Technical/Catalog InformationATS-59005-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodClip
Height0.394" (10mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow6.2°C/W @ 200 LFM
Outline37.00mm x 29.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 59005 C2 R0
ATS59005C2R0
ATS1370 ND
ATS1370ND
ATS1370



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