HEAT SINK 25MM X 32MM X 13MM
ATS-59002-C2-R0: HEAT SINK 25MM X 32MM X 13MM
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Capacitance : | 16.5 pF | Series: | maxiGRIP |
Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
Package Cooled: | Flip Chip Processors | Attachment Method: | Clip |
Shape: | Rectangular, Angled Fins | Length: | 0.984" (24.99mm) |
Width: | 1.260" (32.00mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.512" (13.00mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 6.5°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Technical/Catalog Information | ATS-59002-C2-R0 |
Vendor | Advanced Thermal Solutions Inc |
Category | Thermal Management |
Attachment Method | Clip |
Height | 0.51" (13mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 6.5°C/W @ 200 LFM |
Outline | 32.00mm x 25.00mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | ATS 59002 C2 R0 ATS59002C2R0 ATS1367 ND ATS1367ND ATS1367 |