HEAT SINK 56MM X 56MM X 31MM
ATS-57001-C1-R0: HEAT SINK 56MM X 56MM X 31MM
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Capacitance : | 16.5 pF | Series: | - |
Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
Package Cooled: | LGA | Attachment Method: | Push Pin |
Shape: | Square, Angled Fins | Length: | 2.205" (56.00mm) |
Width: | 2.205" (56.00mm) | Diameter: | - |
Height Off Base (Height of Fin): | 1.220" (31.00mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 1.0°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Technical/Catalog Information | ATS-57001-C1-R0 |
Vendor | Advanced Thermal Solutions Inc |
Category | Thermal Management |
Attachment Method | Push Pin |
Height | 1.2" (31mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 1.01°C/W @ 200 LFM |
Outline | 56.00mm x 56.00mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | ATS 57001 C1 R0 ATS57001C1R0 ATS1358 ND ATS1358ND ATS1358 |