ATS-56011-C4-R0, US $ 9.42-15.48, ATS-56011-C4-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444805 Detail

ATS-56011-C4-R0: HEAT SINK 57.5 X 57.5 X 12.5MM

ATS-56011-C4-R0 Data Sheet

US $ 9.42~15.48 / Piece | Get Latest Price

Part Number:: ATS-56011-C4-R0
Mfg:
Supply Ability:: 5000

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1~10
10~100
100~500
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Unit Price
$15.48
$12.31
$10.61
$9.75
$9.42

Processing time
15 Days
15 Days
15 Days
15 Days
15 Days

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Upload time: 2025/3/14

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	maxiFLOW
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	ASIC	Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Square, Angled Fins	Length:	2.264" (57.50mm)
Width:	2.264" (57.50mm)	Diameter:	-
Height Off Base (Height of Fin):	0.492" (12.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	2.3°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Width: 2.264" (57.50mm)
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Not Included)
Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc
Shape: Square, Angled Fins
Height Off Base (Height of Fin): 0.492" (12.50mm)
Package Cooled: ASIC
Thermal Resistance @ Forced Air Flow: 2.3°C/W @ 200 LFM
Length: 2.264" (57.50mm)

Parameters:

Technical/Catalog Information	ATS-56011-C4-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Not Included)
Height	0.49" (12.5mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	2.3°C/W @ 200 LFM
Outline	57.50mm x 57.50mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 56011 C4 R0 ATS56011C4R0 ATS1356 ND ATS1356ND ATS1356

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ATS-56011-C4-R0

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