ATS-56009-C4-R0, US $ 4.95-8.64, ATS-56009-C4-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444801 Detail

ATS-56009-C4-R0: HEAT SINK 58MM X 30MM X 9MM

ATS-56009-C4-R0 Data Sheet

US $ 4.95~8.64 / Piece | Get Latest Price

Part Number:: ATS-56009-C4-R0
Mfg:
Supply Ability:: 5000

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$8.64
$6.61
$5.6
$5.13
$4.95

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Upload time: 2025/3/13

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	maxiFLOW
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	ASIC	Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Rectangular, Angled Fins	Length:	1.181" (30.00mm)
Width:	2.283" (58.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.354" (9.00mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	4.8°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Width: 2.283" (58.00mm)
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Not Included)
Length: 1.181" (30.00mm)
Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc
Package Cooled: ASIC
Height Off Base (Height of Fin): 0.354" (9.00mm)
Thermal Resistance @ Forced Air Flow: 4.8°C/W @ 200 LFM
Shape: Rectangular, Angled Fins

Parameters:

Technical/Catalog Information	ATS-56009-C4-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Not Included)
Height	0.35" (9mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	4.8°C/W @ 200 LFM
Outline	58.00mm x 30.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 56009 C4 R0 ATS56009C4R0 ATS1354 ND ATS1354ND ATS1354

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ATS-56009-C4-R0

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