ATS-55450D-C2-R0

HEAT SINK 45MM X 45MM X 9.5MM

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SeekIC No. : 003445056 Detail

ATS-55450D-C2-R0: HEAT SINK 45MM X 45MM X 9.5MM

floor Price/Ceiling Price

US $ 2.75~5.18 / Piece | Get Latest Price
Part Number:
ATS-55450D-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • Unit Price
  • $5.18
  • $3.79
  • $3.14
  • $2.89
  • $2.75
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins Length: 1.772" (45.0mm)
Width: 1.772" (45.00mm) Diameter: -
Height Off Base (Height of Fin): 0.374" (9.50mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 9.2°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Shape: Square, Pin Fins
Attachment Method: Thermal Tape, Adhesive (Included)
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.374" (9.50mm)
Length: 1.772" (45.0mm)
Width: 1.772" (45.00mm)
Thermal Resistance @ Forced Air Flow: 9.2°C/W @ 200 LFM


Parameters:

Technical/Catalog InformationATS-55450D-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.375" (9.53mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow9.2°C/W @ 200 LFM
Outline45.00mm x 45.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 55450D C2 R0
ATS55450DC2R0
ATS1279 ND
ATS1279ND
ATS1279



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