ATS-55190D-C2-R0, US $ 2.38-4.48, ATS-55190D-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003445009 Detail

ATS-55190D-C2-R0: HEAT SINK 19MM X 19MM X 9.5MM

ATS-55190D-C2-R0 Data Sheet

US $ 2.38~4.48 / Piece | Get Latest Price

Part Number:: ATS-55190D-C2-R0
Mfg:
Supply Ability:: 5000

Price Break

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0~1
1~10
10~100
100~500
500~1000

Unit Price
$4.48
$3.28
$2.71
$2.5
$2.38

Processing time
15 Days
15 Days
15 Days
15 Days
15 Days

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Upload time: 2024/11/23

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	-
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins	Length:	0.748" (19.00mm)
Width:	0.748" (19.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.374" (9.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	24.0°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Shape: Square, Pin Fins
Attachment Method: Thermal Tape, Adhesive (Included)
Length: 0.748" (19.00mm)
Width: 0.748" (19.00mm)
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.374" (9.50mm)
Thermal Resistance @ Forced Air Flow: 24.0°C/W @ 200 LFM

Parameters:

Technical/Catalog Information	ATS-55190D-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Included)
Height	0.375" (9.53mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	24.0°C/W @ 200 LFM
Outline	19.00mm x 19.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 55190D C2 R0 ATS55190DC2R0 ATS1265 ND ATS1265ND ATS1265

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ATS-55190D-C2-R0

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