ATS-55170R-C2-R0, US $ 3.03-5.71, ATS-55170R-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444492 Detail

ATS-55170R-C2-R0: HEAT SINK 17MM X 17MM X 19.5MM

ATS-55170R-C2-R0 Data Sheet

US $ 3.03~5.71 / Piece | Get Latest Price

Part Number:: ATS-55170R-C2-R0
Mfg:
Supply Ability:: 5000

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1~10
10~100
100~500
500~1000

Unit Price
$5.71
$4.18
$3.46
$3.18
$3.03

Processing time
15 Days
15 Days
15 Days
15 Days
15 Days

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Upload time: 2024/11/23

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	-
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins	Length:	0.669" (17mm)
Width:	0.669" (17.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.768" (19.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	11.3°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Shape: Square, Pin Fins
Attachment Method: Thermal Tape, Adhesive (Included)
Manufacturer: Advanced Thermal Solutions Inc
Length: 0.669" (17mm)
Width: 0.669" (17.00mm)
Height Off Base (Height of Fin): 0.768" (19.50mm)
Thermal Resistance @ Forced Air Flow: 11.3°C/W @ 200 LFM

Parameters:

Technical/Catalog Information	ATS-55170R-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Included)
Height	0.77" (19.5mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	11.3°C/W @ 200 LFM
Outline	17.00mm x 17.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 55170R C2 R0 ATS55170RC2R0 ATS1298 ND ATS1298ND ATS1298

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ATS-55170R-C2-R0

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