ATS-54350K-C2-R0

HEAT SINK 35MM X 35MM X 14.5MM

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SeekIC No. : 003444514 Detail

ATS-54350K-C2-R0: HEAT SINK 35MM X 35MM X 14.5MM

floor Price/Ceiling Price

US $ 3.01~5.66 / Piece | Get Latest Price
Part Number:
ATS-54350K-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • Unit Price
  • $5.66
  • $4.14
  • $3.43
  • $3.16
  • $3.01
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm) Diameter: -
Height Off Base (Height of Fin): 0.571" (14.50mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 5.4°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Width: 1.378" (35.00mm)
Attachment Method: Thermal Tape, Adhesive (Included)
Length: 1.378" (35.00mm)
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.571" (14.50mm)
Thermal Resistance @ Forced Air Flow: 5.4°C/W @ 200 LFM


Parameters:

Technical/Catalog InformationATS-54350K-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.57" (14.5mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow5.4°C/W @ 200 LFM
Outline35.00mm x 35.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 54350K C2 R0
ATS54350KC2R0
ATS1224 ND
ATS1224ND
ATS1224



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