HEAT SINK 33MM X 33MM X 19.5MM
ATS-54330R-C2-R0: HEAT SINK 33MM X 33MM X 19.5MM
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Capacitance : | 16.5 pF | Series: | - |
Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
Package Cooled: | BGA | Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square | Length: | 1.299" (32.99mm) |
Width: | 1.299" (32.99mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.768" (19.50mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 4.1°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Technical/Catalog Information | ATS-54330R-C2-R0 |
Vendor | Advanced Thermal Solutions Inc |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.77" (19.5mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 4.1°C/W @ 200 LFM |
Outline | 33.00mm x 33.00mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | ATS 54330R C2 R0 ATS54330RC2R0 ATS1240 ND ATS1240ND ATS1240 |