ATS-54300W-C2-R0

HEAT SINK 30MM X 30MM X 24.5MM

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SeekIC No. : 003444650 Detail

ATS-54300W-C2-R0: HEAT SINK 30MM X 30MM X 24.5MM

floor Price/Ceiling Price

US $ 3.71~6.99 / Piece | Get Latest Price
Part Number:
ATS-54300W-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • Unit Price
  • $6.99
  • $5.11
  • $4.24
  • $3.9
  • $3.71
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm) Diameter: -
Height Off Base (Height of Fin): 0.964" (24.50mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 3.7°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Included)
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.964" (24.50mm)
Thermal Resistance @ Forced Air Flow: 3.7°C/W @ 200 LFM


Parameters:

Technical/Catalog InformationATS-54300W-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.96" (24.5mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.7°C/W @ 200 LFM
Outline30.00mm x 30.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 54300W C2 R0
ATS54300WC2R0
ATS1254 ND
ATS1254ND
ATS1254



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