ATS-53375K-C2-R0

HEAT SINK 37.5 X 37.5 X 14.5MM

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ATS-53375K-C2-R0 Picture
SeekIC No. : 003444551 Detail

ATS-53375K-C2-R0: HEAT SINK 37.5 X 37.5 X 14.5MM

floor Price/Ceiling Price

US $ 4.43~7.73 / Piece | Get Latest Price
Part Number:
ATS-53375K-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • Unit Price
  • $7.73
  • $5.92
  • $5.01
  • $4.59
  • $4.43
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/12/22

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Product Details

Quick Details

Capacitance : 16.5 pF Series: maxiGRIP
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: BGA Attachment Method: Clip, Thermal Material
Shape: Square Length: 1.476" (37.50mm)
Width: 1.476" (37.50mm) Diameter: -
Height Off Base (Height of Fin): 0.571" (14.50mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 5.0°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Thermal Resistance @ Forced Air Flow: 5.0°C/W @ 200 LFM
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.571" (14.50mm)
Attachment Method: Clip, Thermal Material
Length: 1.476" (37.50mm)
Width: 1.476" (37.50mm)
Series: maxiGRIP


Parameters:

Technical/Catalog InformationATS-53375K-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodClip
Height0.57" (14.5mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow5.0°C/W @ 200 LFM
Outline37.50mm x 37.50mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 53375K C2 R0
ATS53375KC2R0
ATS1175 ND
ATS1175ND
ATS1175



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