ATS-53250K-C2-R0, US $ 4.13-7.22, ATS-53250K-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003445035 Detail

ATS-53250K-C2-R0: HEAT SINK 25MM X 25MM X 14.5MM

ATS-53250K-C2-R0 Data Sheet

US $ 4.13~7.22 / Piece | Get Latest Price

Part Number:: ATS-53250K-C2-R0
Mfg:
Supply Ability:: 5000

Price Break

Qty
0~1
1~10
10~100
100~500
500~1000

Unit Price
$7.22
$5.52
$4.68
$4.28
$4.13

Processing time
15 Days
15 Days
15 Days
15 Days
15 Days

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Upload time: 2024/11/27

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	maxiGRIP
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Clip, Thermal Material
Shape:	Square	Length:	0.984" (24.99mm)
Width:	0.984" (24.99mm)	Diameter:	-
Height Off Base (Height of Fin):	0.571" (14.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	8.1°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Length: 0.984" (24.99mm)
Width: 0.984" (24.99mm)
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.571" (14.50mm)
Thermal Resistance @ Forced Air Flow: 8.1°C/W @ 200 LFM
Attachment Method: Clip, Thermal Material
Series: maxiGRIP

Parameters:

Technical/Catalog Information	ATS-53250K-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Clip
Height	0.57" (14.5mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	8.1°C/W @ 200 LFM
Outline	25.00mm x 25.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 53250K C2 R0 ATS53250KC2R0 ATS1167 ND ATS1167ND ATS1167

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ATS-53250K-C2-R0

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