ATS-53170D-C2-R0, US $ 3.81-7.18, ATS-53170D-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444680 Detail

ATS-53170D-C2-R0: HEAT SINK 17MM X 17MM X 9.5MM

ATS-53170D-C2-R0 Data Sheet

US $ 3.81~7.18 / Piece | Get Latest Price

Part Number:: ATS-53170D-C2-R0
Mfg:
Supply Ability:: 5000

Price Break

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0~1
1~10
10~100
100~500
500~1000

Unit Price
$7.18
$5.25
$4.35
$4
$3.81

Processing time
15 Days
15 Days
15 Days
15 Days
15 Days

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Upload time: 2024/12/26

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	maxiGRIP
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Clip, Thermal Material
Shape:	Square	Length:	0.669" (17mm)
Width:	0.669" (17.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.374" (9.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	24.3°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Manufacturer: Advanced Thermal Solutions Inc
Length: 0.669" (17mm)
Width: 0.669" (17.00mm)
Height Off Base (Height of Fin): 0.374" (9.50mm)
Thermal Resistance @ Forced Air Flow: 24.3°C/W @ 200 LFM
Attachment Method: Clip, Thermal Material
Series: maxiGRIP

Parameters:

Technical/Catalog Information	ATS-53170D-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Clip
Height	0.375" (9.53mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	24.3°C/W @ 200 LFM
Outline	17.00mm x 17.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 53170D C2 R0 ATS53170DC2R0 ATS1147 ND ATS1147ND ATS1147

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ATS-53170D-C2-R0

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