ATS-52300G-C2-R0, US $ 3.9-3.9, ATS-52300G-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003445007 Detail

ATS-52300G-C2-R0: HEAT SINK 30MM X 30MM X 12.5MM

ATS-52300G-C2-R0 Data Sheet

US $ 3.9~3.9 / Piece | Get Latest Price

Part Number:: ATS-52300G-C2-R0
Mfg:
Supply Ability:: 5000

Price Break

Qty
0~100

Unit Price
$3.9

Processing time
15 Days

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Upload time: 2024/12/26

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Product Details

Quick Details

Capacitance :	6 pF	Series:	maxiFLOW
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Angled Fins	Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.492" (12.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	4.4°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Included)
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Thermal Resistance @ Forced Air Flow: 4.4°C/W @ 200 LFM
Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc
Shape: Square, Angled Fins
Height Off Base (Height of Fin): 0.492" (12.50mm)
Material Finish: Blue Anodized

Parameters:

Technical/Catalog Information	ATS-52300G-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Included)
Height	0.49" (12.5mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	4.4°C/W @ 200 LFM
Outline	30.00mm x 30.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 52300G C2 R0 ATS52300GC2R0 ATS1121 ND ATS1121ND ATS1121

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ATS-52300G-C2-R0

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