ATS-50170P-C2-R0, US $ 4.13-6.33, ATS-50170P-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444271 Detail

ATS-50170P-C2-R0: HEAT SINK 17MM X 17MM X 17.5MM

ATS-50170P-C2-R0 Data Sheet

US $ 4.13~6.33 / Piece | Get Latest Price

Part Number:: ATS-50170P-C2-R0
Mfg:
Supply Ability:: 5000

Price Break

Qty
0~1
1~10
10~100

Unit Price
$6.33
$4.85
$4.13

Processing time
15 Days
15 Days
15 Days

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Upload time: 2024/11/21

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Product Details

Quick Details

Capacitance :	6 pF	Series:	maxiGRIP, maxiFLOW
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Clip, Thermal Material
Shape:	Square, Angled Fins	Length:	0.669" (17mm)
Width:	0.669" (17.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.689" (17.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	8.3°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Manufacturer: Advanced Thermal Solutions Inc
Shape: Square, Angled Fins
Material Finish: Blue Anodized
Length: 0.669" (17mm)
Width: 0.669" (17.00mm)
Series: maxiGRIP, maxiFLOW
Attachment Method: Clip, Thermal Material
Height Off Base (Height of Fin): 0.689" (17.50mm)
Thermal Resistance @ Forced Air Flow: 8.3°C/W @ 200 LFM

Parameters:

Technical/Catalog Information	ATS-50170P-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Clip
Height	0.69" (17.53mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	8.3°C/W @ 200 LFM
Outline	17.00mm x 17.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 50170P C2 R0 ATS50170PC2R0 ATS1032 ND ATS1032ND ATS1032

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ATS-50170P-C2-R0

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