SpecificationsHigh performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard.The low profile package design is suitable for a wide variety of applications especially where heigh...
ASMT-MRA0-AGH00: SpecificationsHigh performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard....
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