Features: • 30V/40A , RDS(ON)=9m(typ.) @ VGS=10V RDS(ON)=13m(typ.) @ VGS=4.5V• Super High Dense Cell Design• Avalanche Rated• Reliable and Rugged• Lead Free Available (RoHS Compliant)Application• Power Management in Desktop Computer or DC/DC Converters Specifica...
APM3011NU: Features: • 30V/40A , RDS(ON)=9m(typ.) @ VGS=10V RDS(ON)=13m(typ.) @ VGS=4.5V• Super High Dense Cell Design• Avalanche Rated• Reliable and Rugged• Lead Free Available (...
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Symbol |
Parameter |
Rating |
Unit | |
Common Ratings (TA=25Unless Otherwise Noted) | ||||
VDSS |
Drain-Source Voltage |
30 |
V | |
VGSS |
Gate-Source Voltage |
±20 | ||
TJ |
Maximum Junction Temperature |
150 |
||
TSTG |
Storage Temperature Range |
-55 to 150 |
||
Mounted on Large Heat Sink | ||||
IDP |
300s Pulse Drain Current Tested | TC=25 |
100 |
A |
TC=100 |
65 | |||
ID |
Continuous Drain Current | TC=25 |
40 |
A |
TC=100 |
22 | |||
PD |
Maximum Power Dissipation | TC=25 |
50 |
W |
TC=100 |
20 | |||
RJC |
Thermal Resistance-Junction to Case |
2.5 |
/W | |
Mounted on PCB of 1in2 pad area | ||||
IDP |
300s Pulse Drain Current Tested | TA=25 |
100 |
A |
TA=100 |
65 | |||
ID |
Continuous Drain Current | TA=25 |
10 |
A |
TA=100 |
6 | |||
PD |
Maximum Power Dissipation | TA=25 |
2.5 |
W |
TA=100 |
1 | |||
RJA |
Thermal Resistance-Junction to Ambient |
50 |
/W | |
Mounted on PCB of Minimum Footprint | ||||
IDP |
300s Pulse Drain Current Tested | TA=25 |
100 |
A |
TA=100 |
65 | |||
ID |
Continuous Drain Current | TA=25 |
7 |
A |
TA=100 |
4 | |||
PD |
Maximum Power Dissipation | TA=25 |
1.5 |
W |
TA=100 |
0.5 | |||
RJA |
Thermal Resistance-Junction to Ambient |
75 |
/W |