APF19-19-13CB, US $ 8.91-8.91, APF19-19-13CB DataSheet download, circuit diagram from SeekIC.com

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APF19-19-13CB: HEATSINK LOW-PROFILE FORGED

APF19-19-13CB Data Sheet

US $ 8.91~8.91 / Piece | Get Latest Price

Part Number:: APF19-19-13CB
Mfg:
Supply Ability:: 5000

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$8.91

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Upload time: 2024/7/15

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Recent History
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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	APF
Manufacturer:	CTS Thermal Management Products	Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)	Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Square	Length:	0.748" (19.00mm)
Width:	0.748" (19.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.500" (12.70mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	4.0°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Thermal Resistance @ Natural: -
Manufacturer: CTS Thermal Management Products
Height Off Base (Height of Fin): 0.500" (12.70mm)
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Series: APF
Length: 0.748" (19.00mm)
Width: 0.748" (19.00mm)
Thermal Resistance @ Forced Air Flow: 4.0°C/W @ 200 LFM

Parameters:

Technical/Catalog Information	APF19-19-13CB
Vendor	CTS Thermal Management Products
Category	Fans, Thermal Management
Attachment Method	Thermal Tape, Adhesive (Not Included)
Height	0.5" (12.7mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	4.0°C/W @ 200 LFM
Outline	19.00mm x 19.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	APF19 19 13CB APF191913CB 294 1149 ND 2941149ND 294-1149

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APF19-19-13CB

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