Features: Industry's first programmable logic device (PLD) incorporating system-on-a-programmable-chip (SOPC) integration MultiCoreTM architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory LUT logic used for register-intensive functions Embedded system block (...
APEX20K: Features: Industry's first programmable logic device (PLD) incorporating system-on-a-programmable-chip (SOPC) integration MultiCoreTM architecture integrating look-up table (LUT) logic, product-ter...
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Industry's first programmable logic device (PLD) incorporating system-on-a-programmable-chip (SOPC) integration
MultiCoreTM architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory
LUT logic used for register-intensive functions
Embedded system block (ESB) used to implement memory functions, including first-in first-out (FIFO) buffers, dual-port RAM, and content-addressable memory (CAM)
ESB implementation of product-term logic used for combinatorial-intensive functions
High density
30,000 to 1.5 million typical gates (see Tables 1 and 2)
Up to 51,840 logic elements (LEs)
Up to 442,368 RAM bits that can be used without reducing available logic
Up to 3,456 product-term-based macrocells
Designed for low-power operation
1.8-V and 2.5-V supply voltage (see Table 3)
MultiVoltTM I/O interface support to interface with 1.8-V, 2.5-V, 3.3-V, and 5.0-V devices (see Table 3)
ESB offering programmable power-saving mode
Flexible clock management circuitry with up to four phase-locked loops (PLLs)
Built-in low-skew clock tree
Up to eight global clock signals
ClockLockTM feature reducing clock delay and skew
ClockBoostTM feature providing clock multiplication and division
ClockShiftTM programmable clock phase and delay shifting
Powerful I/O features
Compliant with peripheral component interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 33 or 66 MHz and 32 or 64 bits
Support for high-speed external memories, including DDR SDRAM and ZBT SRAM (ZBT is a trademark of Integrated Device Technology, Inc.)
Bidirectional I/O performance (tCO + tSU) up to 250 MHz
LVDS performance up to 840 Mbits per channel
Direct connection from I/O pins to local interconnect providing fast tCO and tSU times for complex logic
MultiVolt I/O interface support to interface with 1.8-V, 2.5-V, 3.3-V, and 5.0-V devices (see Table 3)
Programmable clamp to VCCIO
Individual tri-state output enable control for each pin
Programmable output slew-rate control to reduce switching noise
Support for advanced I/O standards, including low-voltage differential signaling (LVDS), LVPECL, PCI-X, AGP, CTT, stubseries terminated logic (SSTL-3 and SSTL-2), Gunning transceiver logic plus (GTL+), and high-speed terminated logic (HSTL Class I)
Pull-up on I/O pins before and during configuration
Advanced interconnect structure
Four-level hierarchical FastTrack® Interconnect structure providing fast, predictable interconnect delays
Dedicated carry chain that implements arithmetic functions such as fast adders, counters, and comparators (automatically used by software tools and megafunctions)
Dedicated cascade chain that implements high-speed, high-fan-in logic functions (automatically used by software tools and megafunctions)
Interleaved local interconnect allows one LE to drive 29 other LEs through the fast local interconnect
Advanced packaging options
Available in a variety of packages with 144 to 1,020 pins (see Tables 4 through 7)
FineLine BGATM packages maximize board space efficiency
Advanced software support
Software design support and automatic place-and-route provided by the Altera® QuartusTM II development system for Windows-based PCs, Sun SPARCstations, and HP 9000 Series 700/800 workstations
Altera MegaCore® functions and Altera Megafunction Partners Program (AMPPSM) megafunctions
NativeLinkTM integration with popular synthesis, simulation, and timing analysis tools
Quartus II SignalTapTM embedded logic analyzer simplifies in-system design evaluation by giving access to internal nodes during device operation
Supports popular revision-control software packages including PVCS, Revision Control System (RCS), and Source Code Control System (SCCS )
Symbol | Parameter | Conditions | Min | Max | Unit |
VCCINT | Supply voltage | With respect to ground (2) | 0.5 | 2.5 | V |
VCCIO | 0.5 | 4.6 | V | ||
VI | DC input voltage | 0.5 | 4.6 | V | |
IOUT | DC output current, per pin | 25 | 25 | mA | |
TSTG | Storage temperature | No bias | 65 | 150 | °C |
TAMB | Ambient temperature | Under bias | 65 | 135 | °C |
TJ | Junction temperature | PQFP, RQFP, TQFP, and BGA packages, under bias |
135 | °C | |
Ceramic PGA packages, under bias | 150 | °C |
APEXTM 20K APEX20K devices are the first PLDs designed with the MultiCore architecture, which combines the strengths of LUT-based and productterm- based devices with an enhanced memory structure. LUT-based logic provides optimized performance and efficiency for data-path, registerintensive, mathematical, or digital signal processing (DSP) designs.
Product-term-based logic is optimized for complex combinatorial paths, such as complex state machines. LUT- and product-term-based logic combined with memory functions and a wide variety of MegaCore and AMPP functions make the APEX 20K device architecture uniquely suited for system-on-a-programmable-chip designs. Applications historically requiring a combination of LUT-, product-term-, and memory-based APEX20K devices can now be integrated into one APEX 20K device.
APEX 20KE APEX20K devices are a superset of APEX 20K devices and include additional features such as advanced I/O standard support, CAM, additional global clocks, and enhanced ClockLock clock circuitry. In addition, APEX 20KE devices extend the APEX 20K family to 1.5 million gates. APEX 20KE devices are denoted with an "E" suffix in the device name (e.g., the EP20K1000E device is an APEX 20KE device). Table 8 compares the features included in APEX 20K and APEX 20KE APEX20K devices.