MOSFET P CH 40V 40A TO252
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Series: | - | Manufacturer: | Alpha & Omega Semiconductor Inc | ||
FET Type: | MOSFET P-Channel, Metal Oxide | Transistor Type: | - | ||
Gain : | 15.5 dB | Current - Collector (Ic) (Max): | - | ||
FET Feature: | Logic Level Gate | Drain to Source Voltage (Vdss): | 40V | ||
Voltage - Collector Emitter Breakdown (Max): | - | Current - Continuous Drain (Id) @ 25° C: | 40A | ||
Vce Saturation (Max) @ Ib, Ic: | - | Current - Collector Cutoff (Max): | - | ||
Rds On (Max) @ Id, Vgs: | 22 mOhm @ 12A, 10V | DC Current Gain (hFE) (Min) @ Ic, Vce: | - | ||
Vgs(th) (Max) @ Id: | 3V @ 250µA | Gate Charge (Qg) @ Vgs: | 41nC @ 10V | ||
Frequency - Transition: | - | Input Capacitance (Ciss) @ Vds: | 1870pF @ 20V | ||
Power - Max: | 2.5W | Mounting Type: | Surface Mount | ||
Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 | Supplier Device Package: | TO-252 |
Parameter | Symbol | Maximum | Units | |
Drain-Source Voltage | VDS | -40 | V | |
Gate-Source Voltage | VGS | ±20 | V | |
Continuous Drain Current B,H | TC=25 | ID | -40 | A |
TC=100 | -28 | A | ||
Pulsed Drain Current C | IDM | -50 | A | |
Power Dissipation B | TC=25 | PD | 62.5 | W |
TC=100 | 31 | W | ||
Power Dissipation A | TA=25 | PDSM | 2.5 | W |
TA=70 | 1.6 | |||
Avalanche Current C | IAR | -35 | A | |
Repetitive avalanche energy L=0.1mH C | EAR | 61 | mJ | |
Junction and Storage Temperature Range | TJ, TSTG | -55 to 175 |
A: The value of RJJA is measured with the device in a still air environment with T A =25°C. The power dissipation PDSM and current rating IDSM are
based on TJMAX)=150°C, using steady state junction-to-ambient thermal resistance.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature T J(MAX)=175°C.
D. The RJJA is the sum of the thermal impedence from junction to case R JJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using t 300 s pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.
G. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C.
H. The maximum current rating is limited by bond-wires.
*This device is guaranteed green after data code 8X11 (Sep 1 ST 2008).
Rev1: Oct 2008
The AOD4189 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. With the excellent thermal resistance of the DPAK package, this device is well suited for high current load applications.
-RoHS Compliant
-Halogen Free*