AK08DS300-SOSPA

This AK08DS300-SOSPA new family of Accutek DIP Adapter Modules converts surface mount IC's to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC's. Package types supported are: SOJ, PLCC, SOIC, SOP, TSOP, QSOP, HSOP, MSOP, LLP (Leadless Leadframe Package), CSP (Chip Scale Package) and CLCC.

These AK08DS300-SOSPA DIP Adapters were developed for users with motherboard designs that require DIP's, nowobsoleted by manufacturers. These adapter modules save costly motherboard redesigns.

Available with machined or flat contact pins. Accutek DIP Adapter Modules feature 4 to 84 pins, are fully assembled and tested and may include a decoupling capacitor. These AK08DS300-SOSPA DIP Adapters can be manufactured turnkey or from customer supplied surface mount chips. Modules range in length from 0.200" to 4.200" depending on number of pins and incorporate 0.300", 0.400", 0.600", 0.900", 1.200" and 1.400" row-to-row spacing with 0.100" lead spacing.

Custom configurations up to 200 pins, multi-chip and double sided modules are also available for special functions. A variety of pin lengths with varying diameters as well as custom sizes and spacing can be specified with different materials and finishes. All AK08DS300-SOSPA modules are designed in-house using PCB CAD workstations. Automated assembly and 100% testing are also performed in-house.