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ADG622

Features: 5.5 (Max) On Resistance 0.9 (Max) On-Resistance Flatness 2.7 V to 5.5 V Single Supply ±2.7 V to ±5.5 V Dual Supply Rail-to-Rail Operation 10-Lead SOIC Package Typical Power Consumption (<0.01 W) TTL/CMOS Compatible InputsApplicationAutomatic Test EquipmentPower RoutingCommunication...

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SeekIC No. : 004275095 Detail

ADG622: Features: 5.5 (Max) On Resistance 0.9 (Max) On-Resistance Flatness 2.7 V to 5.5 V Single Supply ±2.7 V to ±5.5 V Dual Supply Rail-to-Rail Operation 10-Lead SOIC Package Typical Power Consumption ...

ADG622 Data Sheet

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Part Number:
ADG622
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

5.5 (Max) On Resistance
0.9 (Max) On-Resistance Flatness
2.7 V to 5.5 V Single Supply
±2.7 V to ±5.5 V Dual Supply
Rail-to-Rail Operation
10-Lead SOIC Package
Typical Power Consumption (<0.01 W)
TTL/CMOS Compatible Inputs 


Application

Automatic Test Equipment
Power Routing
Communication Systems
Data Acquisition Systems
Sample and Hold Systems
Avionics
Relay Replacement
Battery-Powered Systems


Pinout

Connection Diagram


Specifications

VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . 13 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . .. . . 0.3 V to +6.5 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 6.5 V
Analog Inputs2 . . . . . . . . . . . .  . . .VSS 0.3 V to VDD + 0.3 V
Digital Inputs2 . . . . . . . . . . .. . . . . . . 0.3 V to VDD + 0.3 V or
                                                  30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . .  . . 50 mA
Operating Temperature Range
   Industrial (B Version) . . . . . . . . . . . . . . . .  .40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
µSOIC Package
   JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
   JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
Lead Temperature, Soldering (10 seconds) . . .. . . . . . . 300°C
   IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220°C


Description

The ADG621/ADG622/ADG623 are monolithic, CMOS SPST (single-pole, single-throw) switches. Each switch conducts equally well in both directions when on.

The ADG621/ADG622/ADG623 contain two independent switches. The product differs only in that both switches are normally open and normally closed respectively. In the ADG623, Switch 1 is normally open and Switch 2 is normally closed. The ADG623 exhibits break-before-make switching action.

The ADG621/ADG622/ADG623 offers low on-resistance of 4 Ω, which is matched to within 0.25 Ω between channels. These switches also provide low power dissipation yet gives high switching speeds. The product are available in a 10-lead µSOIC package.




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