AD7883

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . .. . .  . .. 0.3 V to VDD + 0.3 V
VINA, VINB to AGND (Figure 4) . . . .. . .  .. . 0.3 V to VDD + 0.3 V
VINA to AGND (Figure 5) . . . . .. .  v. VDD 0.3 V to VDD + 0.3 V
VREF to AGND . . . . . . . . . . . . . .  . . . . . . . . . . . . . . . . 0.3 V to VDD
Digital Inputs to DGND . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Digital Outputs to DGND . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . .. . . . . . . . . . . . . 40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . . 65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . .. . .  . . . . . .+300°C
Power Dissipation (Any Package) to +75°C . . . . ... . . .  . . 450 mW
Derates above +75°C by . . . . . . . . . . . . . . . . . . . . . . . 10 mW/°C

The AD7883 is a high speed, low power, 12-bit A/D converter which operates from a single +3 V to +3.6 V supply. It consists of a 5 ms track/hold amplifier, a 15 ms successive-approximation ADC, versatile interface logic and a multiple-input-range circuit. The part also includes a power save feature.

Fast bus access times and standard control inputs ensure easy interfacing to modern microprocessors and digital signal processors.

The AD7883 features a total throughput time of 20 ms and can convert full power signals up to 25 kHz with a sampling frequency of 50 kHz.

In addition to the traditional dc accuracy specifications such as linearity, full-scale and offset errors, the AD7883 is also fully specified for dynamic performance parameters including harmonic distortion and signal-to-noise ratio.

The AD7883 is fabricated in Analog Devices' Linear Compatible CMOS (LC2MOS) process, a mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in a 24-pin, 0.3 inch-wide, plastic dual-in-line package (DIP) as well as a small 24-lead SOIC package.