AD7853

Specified for VDD of 3 V to 5.5 V Read-Only Operation AD7853200 kSPS; AD7853L100 kSPS System and Self-Calibration with Autocalibration onPower-Up Low Power: AD7853: 12 mW (VDD = 3 V) AD7853L: 4.5 mW (VDD = 3 V) Automatic Power Down After Conversion (25W) Flexible Serial Interface: 8051/SPI™/QSPI™/P Compatible 24-Lead DIP, SOIC and SSOP Package

Battery-Powered Systems (Personal Digital Assistants, Medical Instruments, Mobile Communications) Pen Computers Instrumentation and Control Systems High Speed Modems

(TA = +25°C unless otherwise noted)
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . ....................0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . ..................... 0.3 V to +7 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . .................0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . ....................0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND . . . . .....................0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . . .....................0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND . . . . . . . . . ......................0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies2 . . . . . . . .................... ±10 mA
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . .....................40°C to +85°C
Storage Temperature Range . . . . . . . . . . ...................65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .................. +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . .....................450 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . ..................... 105°C/W
qJC Thermal Impedance . . . . . . . . . . . . . . . . . . . ...................... 34.7°C/W
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . ...................... +260°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . ....................... 450 mW
qJA Thermal Impedance . . .................... 75°C/W (SOIC) 115°C/W (SSOP)
qJC Thermal Impedance . . . .................... 25°C/W (SOIC) 35°C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .......................... +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . ...........................+220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ....................... >3 kV
NOTES
¹Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
²Transient currents of up to 100 mA will not cause SCR latch-up.

The AD7853/AD7853L are high speed, low power, 12-bit ADCs that operate from a single 3 V or 5 V power supply, the AD7853 being optimized for speed and the AD7853L for low power. The ADC powers up with a set of default conditions at which time it can be operated as a read-only ADC. The ADC contains self-calibration and system-calibration options to ensure accurate operation over time and temperature and have a number of power-down options for low power applications. The part powers up with a set of default conditions and can operate as a read only ADC.

The AD7853 is capable of 200 kHz throughput rate while the AD7853L is capable of 100 kHz throughput rate. The input track-and-hold acquires a signal in 500 ns and features a pseudodifferential sampling scheme. The AD7853/AD7853L voltage range is 0 to VREF with both straight binary and twos complement output coding. Input signal range is to the supply, and the part is capable of converting full power signals to 100 kHz.

CMOS construction ensures low power dissipation of typically 4.5 mW for normal operation and 1.15 mW in power-down mode, with a throughput rate of 10 kSPS (VDD = 3 V). The part is available in 24-lead, 0.3 inch wide dual-in-line package (DIP), 24-lead small outline (SOIC) and 24-lead small shrink outline (SSOP) packages.