AD7813

Features: `8-/10-Bit ADC with 2.3 s Conversion Time`On-Chip Track and Hold`Operating Supply Range: 2.7 V to 5.5 V`Specifications at 2.7 V3.6 V and 5 V  10%`8-Bit Parallel Interface8-Bit + 2-Bit Read`Power PerformanceNormal Operation10.5 mW, VDD = 3 VAutomatic Power-Down34.6 W @ 1 kSPS, VDD = 3 V`...

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AD7813 Picture
SeekIC No. : 004270893 Detail

AD7813: Features: `8-/10-Bit ADC with 2.3 s Conversion Time`On-Chip Track and Hold`Operating Supply Range: 2.7 V to 5.5 V`Specifications at 2.7 V3.6 V and 5 V  10%`8-Bit Parallel Interface8-Bit + 2-Bit Rea...

floor Price/Ceiling Price

Part Number:
AD7813
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

`8-/10-Bit ADC with 2.3 s Conversion Time
`On-Chip Track and Hold
`Operating Supply Range: 2.7 V to 5.5 V
`Specifications at 2.7 V3.6 V and 5 V  10%
`8-Bit Parallel Interface
8-Bit + 2-Bit Read
`Power Performance
Normal Operation
10.5 mW, VDD = 3 V
Automatic Power-Down
34.6 W @ 1 kSPS, VDD = 3 V
`Analog Input Range: 0 V to VREF
`Reference Input Range: 1.2 V to VDD






Pinout

AD7813 Diagram




Specifications

Resolution (Bits) 10bit
T-Put Rate 400kSPS
# Chan 1
Supply V Single(+3),Single(+3.3),Single(+5)
Pwr Diss 17.5mW
Interface Byte
Ain Range Uni (Vref)
SNR (dB) 58dB
Pkg Type DIP,SOIC,SOP


VDD to DGND . . . . . . . . . . . . . . . . . . .. . . . . 0.3 V to +7 V
Digital Input Voltage to DGND
(CONVST, RD, CS) . . . . . . . . . . . .. . 0.3 V, VDD + 0.3 V
Digital Output Voltage to DGND
(BUSY, DB0DB7) . . . . . . . . . . . .. . 0.3 V, VDD + 0.3 V
REFIN to AGND . . . . . . . . . . . . . . . . . . . 0.3 V, VDD + 0.3 V
Analog Input . . . . . . . . . . . . . . . . . .. . . 0.3 V, VDD + 0.3 V
Storage Temperature Range . . . . . . .. . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Plastic DIP Package, Power Dissipation . . . . . . .. . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . .. . . . 105°C/W
Lead Temperature, (Soldering 10 sec) . . .. . . . . . 260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . .. .450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . .115°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . .. . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C






Description

The AD7813 is a high-speed, microprocessor-compatible, 8-/10-bit analog-to-digital converter with a maximum throughput of 400 kSPS. The converter operates off a single 2.7 V to 5.5 V supply and contains a 2.3 s successive approximation A/D converter, track/hold circuitry, on-chip clock oscillator and 8-bit wide parallel interface. The parallel interface is designed to allow easy interfacing to microprocessors and DSPs. The 10-bit conversion result is read by carrying out two 8-bit read operations. The first read operation accesses the 8 MSBs of the ADC conversion result and the second read accesses the 2 LSBs. Using only address decoding logic the AD7813 is easily mapped into the microprocessor address space.

When used in its power-down mode, the AD7813 automatically powers down at the end of a conversion and powers up at the start of a new conversion. This feature significantly reduces the power consumption of the part at lower throughput rates. The AD7813 can also operate in a high speed mode where the part is not powered down between conversions. In this mode of operation the part is capable of providing 400 kSPS throughput.

The part AD7813 is available in a small, 16-lead, 0.3" wide, plastic dualin-line package (DIP), in a 16-lead, 0.15" wide, narrow body small outline IC (SOIC) and in a 16-lead thin shrink small outline package (TSSOP).






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