ACPL-5630L

Maximum Input Diode Current :
Packaging :
Maximum Reverse Diode Voltage : 5 V
Maximum Operating Temperature : + 100 C
Package / Case : DIP-8
Minimum Operating Temperature : - 55 C
Maximum Baud Rate : 10 MBps
Maximum Forward Diode Voltage : 1.85 V
Maximum Power Dissipation : 200 mW
Current Transfer Ratio : 100 %


Description

The ACPL-5630L is a commercial grade two channel hermetically sealed 3.3V optocoupler in an 8-Pin ceramic DIP package with gold plated leads. Solder dipped leads and various lead form options are also available. See the datasheet for details. The product ACPL-5630L is capable of operation and storage over the full military temperature range and may also be purchased with full MIL-PRF-38534 Class Level H or K testing or from the DSCC Drawing 5962-08242. All devices ACPL-5630L are manufactured and tested on a MIL-PRF-38534 certified line and the Class H and K versions are included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. The device contains a GaAsP light emitting diode which is optically coupled to an integrated high speed photon detector. The output of the detector ACPL-5630L is an open collector Schottky clamped transistor. Internal shields provide a guaranteed common mode transient immunity specification of 1000 V/micro-second. Package styles for this die set in one or channels are 8 and 16-Pin DIP through hole. All devices may be purchased with a variety of lead forms and plating options. See the datasheet for details. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in the datasheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts of ACPL-5630L. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for reliability test results.