Features: • Excellent thermal and electrical conductivity• Good dispensability and good fillet formation• Good performance on Ag/Cu leadframes• Low moisture absorptionDescriptionABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal res...
ABLEBOND® 2815A: Features: • Excellent thermal and electrical conductivity• Good dispensability and good fillet formation• Good performance on Ag/Cu leadframes• Low moisture absorptionDescrip...
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ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.