A6833

Output Voltage, V_OUT .....................................................30 V
Logic Supply Voltage, V_DD.................................................7 V
Input Voltage Range, V_IN .....................0.3 V to V_DD +0.3 V
Continuous Output Current (each output), I_OUT ...... 125 mA
Package Power Dissipation, P_D
A6833SA..................................................................... 3.5 W*
A6833SEP.................................................................... 2.5 W*
Operating Temperature Range
Ambient Temperature, T_A...........................20°C to +85°C
Storage Temperature, T_S .........................55°C to +150°C
*Derate linearly to 0 W at +150°C.
Caution: CMOS devices have input-static protection, but are susceptible to damage when exposed to extremely high static-electrical charges.

• 3.3 V to 5 V logic supply range
• To 10 MHz data input rate
• Schmitt trigger inputs for improved noise immunity
• 30 V minimum output breakdown
• Darlington current-sink outputs
• Low-power CMOS logic and latches

• Thermal printheads
• Multiplexed LED displays
• Incandescent lamps

Designed to reduce logic supply current, chip size, and system cost, the A6833 integrated circuits offer high-speed operation for thermal printers. These devices can also be used to drive multiplexed LED displays or incandescent lamps within their 125 mA peak output current rating.

The combination of bipolar and MOS technologies gives the A6833 smart power ICs an interface flexibility beyond the reach of standard buffers and power driver circuits. These 32-bit drivers have bipolar open-collector npn Darlington outputs, a CMOS data latch for each of the drivers, a 32-bit CMOS shift register, and CMOS control circuitry.

The high-speed CMOS shift registers and latches allow operation with most microprocessor-based systems. Use of these drivers with TTL may require input pull-up resistors to ensure an input logic high. CMOS serial data outputs permit cascading for applications requiring additional drive lines. The A6833 is supplied in a 44-lead plastic chip carrier (quad pack), intended for surface mounting on solder lands with 0.050 in. (1.27 mm) centers. These devices are lead (Pb) free, with 100% matte tin plated leadframes.