IC DRIVER QUAD 60V 300MA 16-DIP
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Series: | - | Manufacturer: | Allegro Microsystems Inc | ||
Type: | Low Side | Input Type: | Non-Inverting | ||
Number of Outputs: | 4 | Package / Case : | SSOP-20 | ||
On-State Resistance: | - | Current - Output / Channel: | 300mA | ||
Current - Peak Output: | 500mA | Voltage - Supply: | 4.75 V ~ 5.25 V | ||
Operating Temperature: | -40°C ~ 85°C | Mounting Type: | Through Hole | ||
Package / Case: | 16-DIP (0.300", 7.62mm) | Supplier Device Package: | 16-DIP |
The A2557xB, A2557xEB, and A2557xLB have been specifically designed to provide cost-effective solutions to relay-driving applications with up to 300 mA drive current per channel. A2557xB, A2557xEB, and A2557xLB may also be used for driving incandescent lamps in applications where turn-on time is not a concern. Each of the four outputs will sink 300 mA in the on state. The outputs have a minimum breakdown voltage of 60 V and a sustaining voltage of 40 V. A low-power Sleep Mode is activated with either ENABLE low or all inputs low. In this mode, the supply current of A2557xB, A2557xEB, and A2557xLB drops to below 100 µA.
Over-current protection for each channel has been designed into these devices and is activated at a nominal 500 mA. A2557xB, A2557xEB, and A2557xLB protect each output from short circuits with supply voltages up to 32 V. When an output experiences a short circuit, the output current is limited at the 500 mA current clamp. In addition, foldback circuitry decreases the current limit if an excessive voltage is present across the output and assists in keeping the A2557xB, A2557xEB, and A2557xLB within its SOA (safe operating area). An exclusive-OR circuit compares the input and output state of each driver. If either a short or open load condition is detected, a single FAULT output is turned on (active low).
Continuous or multiple overload conditions causing the channel temperature to reach approximately 165°C will result in an additional linear decrease in the output current of the affected driver. If the fault condition is corrected, the output stage of A2557xB, A2557xEB, and A2557xLB will return to its normal saturated condition.
The packages of A2557xB, A2557xEB, and A2557xLB offer fused leads for enhanced thermal dissipation. Package B is 16-pin power DIP with exposed tabs, EB is 28-lead power PLCCs, and LB are 16-lead power wide-body SOICs for surface-mount applications. The lead (Pb) free versions have 100% matte tin leadframe plating.