Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb- free·The product itself will remain within RoHS compliant version.Application·Automotive: backlighting in dashboard and switch.·Telecommuni...
93-21UYOC/S530-XX/TR8: Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase reflow solder process.·Eia std. package.·IC compatible.·Pb- free·The product itself will remain wit...
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Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase...
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
25 |
mA |
Operating Temperature |
Topr |
-40 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +100 |
|
Electrostatic Discharge(HBM) |
ESD |
2000 |
V |
Power Dissipation |
Pd |
60 |
mW |
Peak Forward Current(Duty 1/10 @ 1KHZ) |
IFP |
60 |
mA |
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |