Features: Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflowsolder process.EIA std. package.IC compatible.Pb- free.The product itself will remain within RoHScompliant version.ApplicationTelecommunication: indicator and backlighting intelephone and fax.Ind...
93-21SYGC/S530-XX/TR8: Features: Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflowsolder process.EIA std. package.IC compatible.Pb- free.The product itself will remain within Ro...
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Features: ·Compatible with automatic placement equipment.·Compatible with infrared and vapor phase...
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
25 |
mA |
Operating Temperature |
Topr |
-40~ +85 |
|
Storage Temperature |
Tstg |
-40~ +100 |
|
Electrostatic Discharge(HBM) |
ESD |
2000 |
V |
Power Dissipation |
Pd |
60 |
mW |
Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
60 |
mA |
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |