8XC196MC

Features: ` High-Performance CHMOS 16-Bit CPU` 16 Kbytes of On-Chip OTPROM/ Factory-Programmed OTPROM` 488 bytes of On-Chip Register RAM` Register to Register Architecture` Up to 53 I/O Lines` Peripheral Transaction Server (PTS) with 11 Prioritized Sources` Event Processor ArraY(EPA) 4 High Speed ...

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8XC196MC Picture
SeekIC No. : 004257897 Detail

8XC196MC: Features: ` High-Performance CHMOS 16-Bit CPU` 16 Kbytes of On-Chip OTPROM/ Factory-Programmed OTPROM` 488 bytes of On-Chip Register RAM` Register to Register Architecture` Up to 53 I/O Lines` Perip...

floor Price/Ceiling Price

Part Number:
8XC196MC
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

` High-Performance CHMOS 16-Bit CPU
` 16 Kbytes of On-Chip OTPROM/ Factory-Programmed OTPROM
` 488 bytes of On-Chip Register RAM
` Register to Register Architecture
` Up to 53 I/O Lines
` Peripheral Transaction Server (PTS) with 11 Prioritized Sources
` Event Processor ArraY(EPA)
  4 High Speed Capture/Compare Modules
  4 High Speed Compare Modules
` Extended Temperature Standard
` Two 16-Bit Timers with Quadrature Decoder Input
` 3-Phase ComplementarYWaveform Generator
` 13 Channel 8/10-Bit A/D with Sample/ Hold with Zero Offset Adjustment H/W
` 14 Prioritized Interrupt Sources
` Flexible 8-/16-Bit External Bus
` 1.75 s 16 x 16 Multiply
` 3 s 32/16 Divide
` Idle and Power Down Modes



Pinout

  Connection Diagram


Specifications

Ambient Temperature Under Bias ....................-40°C to +85°C
Storage Temperature ....................................-65°C to +150°C
Voltage from EA or VPP to VSS or ANGND.....................+13.00V
Voltage on VPP or EQ to VSS or ANGND ..............-0.5V to 13.0V
Voltage on Any Other Pin to VSS or ANGND ....-0.5V to +7.0V(1)
Power Dissipation .........................................................1.5W(2)

NOTES:
1. This includes VPP and EA on ROM or CPU only devices.
2. Power dissipation is based on package heat transfer limitations,  not device power consumption.




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