84-1LMISR4 Selling Leads, Price trend, 84-1LMISR4 DataSheet download, circuit diagram from SeekIC.com

Features: • Excellent dispensability with minimal tailing and stringing• Box oven cureDescriptionABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhe...

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SeekIC No. : 004256044 Detail

84-1LMISR4: Features: • Excellent dispensability with minimal tailing and stringing• Box oven cureDescriptionABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated ...

84-1LMISR4 Data Sheet

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Part Number:: 84-1LMISR4
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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Upload time: 2025/2/15

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84-1 evaluate
US $.68 - .68 / Piece

NAILCLIP METAL HI TEMP

Product Details

Description

Features:

• Excellent dispensability with minimal tailing and stringing
• Box oven cure

Description

ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.

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84-1LMISR4

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