Features: *80C51 based architecture*Inter-Integrated Circuit (I2C) serial bus interface*Small package sizes 24-pin DIP (300 mil skinny DIP ) 24-pin Shrink Small Outline Package 28-pin PLCC*87C751 available in one-time programmable plastic packages*Wide oscillator frequency range*Low power cons...
83C751: Features: *80C51 based architecture*Inter-Integrated Circuit (I2C) serial bus interface*Small package sizes 24-pin DIP (300 mil skinny DIP ) 24-pin Shrink Small Outline Package 28-pin PLCC*87C75...
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PARAMETER | RATING | UNIT |
Storage temperature range | 65 to +150 | |
Voltage from VCC to VSS | 0.5 to +6.5 | V |
Voltage from any pin to VSS (except V PP) | 0.5 to VCC + 0.5 |
V |
Power dissipation | 1.0 | W |
Voltage on VPP pin to VSS | 0 to +13.0 | V |
Maximum IOL per I/O pin | 10 | mA |
The Philips 83C751/87C751 offers the advantages of the 80C51 architecture in a small package and at low cost.
The 8XC751 Microcontroller is fabricated with Philips high-density CMOS technology. Philips epitaxial substrate minimizes CMOS latch-up sensitivity.
The 8XC751 contains a 2k × 8 ROM (83C751) EPROM (87C751), a 64 × 8 RAM, 19 I2/O lines, a 16-bit auto-reload counter/timer, a five-source, fixed-priority level interrupt structure, a bidirectional inter-integrated circuit (I2C) serial bus interface, and an on-chip oscillator.
The on-board inter-integrated circuit (I2C) bus interface allows the8XC751 to operate as a master or slave device on the I2C small area network. This capability facilitates I2/O and RAM expansion, access to EEPROM, processor-to-processor communication, and efficient interface to a wide variety of dedicated I C peripherals.