834000T00000 Selling Leads, Price trend, 834000T00000 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003445209 Detail

834000T00000: HEATSINK STAMP 19.4X25.4X11.4MM

834000T00000 Data Sheet

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Part Number:: 834000T00000
Mfg:
Supply Ability:: 5000

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1~5000

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Upload time: 2025/2/15

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Recent History
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8340 060100 evaluate
US $187.88 - 231.71 / Piece

Multi-Paired Cable 24AWG 10PR SHIELD 100ft SPOOL CHROME
83400000000 evaluate
Fuseholders, Clips, & Hardware PCB Vertical Mount for 5x20mm Fuses
83400000005 evaluate
US $.48 - .56 / Piece

Fuseholders, Clips, & Hardware PCB VERT MOUNT FOR 5X20MM FUSE

Product Details

Quick Details

Capacitance :	18.18 pF	Series:	-
Manufacturer:	Comair Rotron	Type:	Board Level
Package Cooled:	TO-263 (D²Pak)	Attachment Method:	SMD Pad
Shape:	Rectangular	Length:	0.763" (19.38mm)
Width:	1.000" (25.40mm)	Diameter:	-
Height Off Base (Height of Fin):	0.450" (11.43mm)	Power Dissipation @ Temperature Rise:	1.5W @ 20°C
Thermal Resistance @ Forced Air Flow:	4.0°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Copper

Description

Type: Board Level
Diameter: -
Height Off Base (Height of Fin): 0.450" (11.43mm)
Series: -
Shape: Rectangular
Thermal Resistance @ Natural: -
Manufacturer: Comair Rotron
Width: 1.000" (25.40mm)
Thermal Resistance @ Forced Air Flow: 4.0°C/W @ 200 LFM
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Material: Copper
Material Finish: Tin
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Length: 0.763" (19.38mm)

Parameters:

Technical/Catalog Information	834000T00000
Vendor	Comair-Rotron
Category	Thermal Management
Attachment Method	SMD Pad
Height	0.45" (11.43mm)
Material	Copper
Package Cooled	D²Pak
Power Dissipation @ Temperature Rise	1.5W @ 20°C
Thermal Resistance @ Forced Air Flow	4.0°C/W @ 200 LFM
Outline	25.40mm x 19.40mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	834000T00000 834000T00000 CR518 ND CR518ND CR518

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