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SeekIC No. : 003444293 Detail

833900T00000: HEATSINK STAMP 25.9X15X9.5MM

833900T00000 Data Sheet

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Part Number:: 833900T00000
Mfg:
Supply Ability:: 5000

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1~5000

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Upload time: 2025/2/15

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Recent History
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Product Details

Quick Details

Capacitance :	18.18 pF	Series:	-
Manufacturer:	Comair Rotron	Type:	Board Level
Package Cooled:	D²Pak, PowerSO-10	Attachment Method:	SMD Pad
Shape:	Rectangular	Length:	0.590" (14.99mm)
Width:	1.020" (25.91mm)	Diameter:	-
Height Off Base (Height of Fin):	0.375" (9.52mm)	Power Dissipation @ Temperature Rise:	2W @ 40°C
Thermal Resistance @ Forced Air Flow:	5°C/W @ 400 LFM	Thermal Resistance @ Natural:	-
Material:	Copper

Description

Type: Board Level
Diameter: -
Series: -
Shape: Rectangular
Thermal Resistance @ Natural: -
Manufacturer: Comair Rotron
Width: 1.020" (25.91mm)
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 2W @ 40°C
Attachment Method: SMD Pad
Material: Copper
Material Finish: Tin
Package Cooled: D²Pak, PowerSO-10
Length: 0.590" (14.99mm)
Thermal Resistance @ Forced Air Flow: 5°C/W @ 400 LFM

Parameters:

Technical/Catalog Information	833900T00000
Vendor	Comair-Rotron
Category	Fans, Thermal Management
Attachment Method	SMD Pad
Height	0.375" (9.53mm)
Material	Copper
Package Cooled	D²Pak
Power Dissipation @ Temperature Rise	2W @ 40°C
Thermal Resistance @ Forced Air Flow	5°C/W @ 400 LFM
Outline	25.90mm x 15.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	833900T00000 833900T00000 CR504 ND CR504ND CR504

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