HEATSINK STAMP 26.2X12.7X9.9MM
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Capacitance : | 18.18 pF | Series: | - |
Manufacturer: | Comair Rotron | Type: | Top Mount |
Package Cooled: | TO-263 (D²Pak) | Attachment Method: | SMD Pad |
Shape: | Rectangular | Length: | 0.500" (12.70mm) |
Width: | 1.031" (26.20mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.390" (9.91mm) | Power Dissipation @ Temperature Rise: | 1.25W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 10.0°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
Material: | Copper |
Technical/Catalog Information | 832700T00000 |
Vendor | Comair-Rotron |
Category | Fans, Thermal Management |
Attachment Method | SMD Pad |
Height | 0.39" (9.9mm) |
Material | Copper |
Package Cooled | D²Pak |
Power Dissipation @ Temperature Rise | 1.25W @ 30°C |
Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM |
Outline | 26.16mm x 12.70mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 832700T00000 832700T00000 CR471 ND CR471ND CR471 |