83024

83024 is single, dual, and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DSCC Drawing. 83024 is manufactured and tested on a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufacturers List QML- 38534 for Hybrid Microcircuits.

83024 contains a GaAsP light emitting diode which is optically coupled to an integrated high gain photon detector. The high gain output stage features an open collector output providing both lower saturation voltage and higher signaling speed than possible with conventional photo-Darlington optocouplers. The shallow depth and small junctions offered by the IC process provides better radiation immunity than conventional photo transistor optocouplers.

The supply voltage can be operated as low as 2.0 V without adversely affecting the parametric performance.

83024 has a 300% minimum CTR at an input current of only 0.5 mA making them ideal for use in low input current applications such as MOS, CMOS, low power logic interfaces or line receivers. Compatibility with high voltage CMOS logic systems is assured by specifying ICCH and IOH at 18 Volts.

Upon special request, the following 83024 selections can be made: CTR minimum of up to 600% at 0.5 mA, and lower output leakage current levels to 100 mA.Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2).Devices may be purchased with a variety of lead bend and plating options. See Selection Guide table for details. Standard Military Drawing (SMD) parts are available for each package and lead style.

Because the same electrical die (emitters and detectors) are used for each channel of each 83024 listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts except as noted. Additionally, the same package assembly processes and materials are used in 83024. These similarities justify the use of a common data base for die related reliability and certain limited radiation test results.