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80C186XL

Features: Low Power Fully Static Versions of 80C18680C188Operation Modes -Enhanced Mode -DRAM Refresh Control Unit-Power-Save Mode -Direct Interface to 80C187(80C186XL Only)-Compatible Mode -NMOS 8018680188 Pin-for-Pin Replacement for Non-Numerics ApplicationsIntegrated Feature -SetStatic Modular...

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SeekIC No. : 004253677 Detail

80C186XL: Features: Low Power Fully Static Versions of 80C18680C188Operation Modes -Enhanced Mode -DRAM Refresh Control Unit-Power-Save Mode -Direct Interface to 80C187(80C186XL Only)-Compatible Mode -NMOS 80...

80C186XL Data Sheet

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Part Number:
80C186XL
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Low Power Fully Static Versions of 80C18680C188
Operation Modes
   -Enhanced Mode
      -DRAM Refresh Control Unit
      -Power-Save Mode
      -Direct Interface to 80C187(80C186XL Only)
   -Compatible Mode
      -NMOS 8018680188 Pin-for-Pin Replacement for Non-Numerics Applications
Integrated Feature
   -SetStatic Modular 
   -CPUClock Generator
   -2 Independent DMA Channels
   -Programmable Interrupt Controller
   -3 Programmable 16-Bit Timers
   -Dynamic RAM Refresh Control Unit
   -Programmable Memory and Peripheral Chip Select Logic
   -Programmable Wait State Generator
   -Local Bus Controller
   -Power-Save Mode
   -System-Level Testing Support (High Impedance Test Mode)
Completely Object Code Compatible with Existing 80868088 Software and Has 10 Additional Instructions over
80868088
Speed Versions Available25 MHz (80C186XL2580C188XL25)20 MHz (80C186XL2080C188XL20)12 MHz(80C186XL1280C188XL12)
Direct Addressing Capability to 1 MByte Memory and 64 Kbyte IO
Available in 68-Pin
   -Plastic Leaded Chip Carrier (PLCC)
   -Ceramic Pin Grid Array (PGA)
   -Ceramic Leadless Chip Carrier (JEDEC A Package)
Available in 80-Pin
   -Quad Flat Pack (EIAJ)
   -Shrink Quad Flat Pack (SGFP)
Available in Extended TemperatureRange ( -40to +85)



Pinout

Connection Diagram Connection Diagram Connection Diagram


Specifications

Ambient TemperatureunderBias ...........0Cto 70C
Storage Temperature .......................65Cto 150C
Voltage on Any Pin with
    RespecttoGround ..........................10V to 70V
Package Power Dissipation............................1W
Not to exceed the maximum allowable die tempera ture based on thermal resistance of the package
NOTICE This data sheet contains preliminary infor-mation on new products in production The specifica-tions are subject to change without notice Verify with your local Intel Sales office that you have the latest data sheet before finalizing a design
WARNING Stressing the device beyond the ''Absolute Maximum Ratings'' may cause permanent damage These are stress ratings only Operation beyond the''Operating Conditions'' is not recommended and ex-tended exposure beyond the ''Operating Conditions''may affect device reliability
NOTICE The specifications are subject to change without notice



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