Features: High-Performance Embedded Architecture - 25 MIPS Burst Execution at 25 MHz - 9.4 MIPS* Sustained Execution at 25 MHz On-Chip Floating Point Unit - Supports IEEE 754 Floating Point Standard - Full Transcendental Support - Four 80-Bit Registers - 13.6 Million Whetstones/s(Single Precision)...
80960MC: Features: High-Performance Embedded Architecture - 25 MIPS Burst Execution at 25 MHz - 9.4 MIPS* Sustained Execution at 25 MHz On-Chip Floating Point Unit - Supports IEEE 754 Floating Point Standard...
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PinoutSpecificationsStorage Temperature..................... ......65to 150Case TemperatureUnder B...
PinoutSpecificationsStorage Temperature..................... ......65to 150Case TemperatureUnder B...
High-Performance Embedded Architecture
- 25 MIPS Burst Execution at 25 MHz
- 9.4 MIPS* Sustained Execution at 25 MHz
On-Chip Floating Point Unit
- Supports IEEE 754 Floating Point Standard
- Full Transcendental Support
- Four 80-Bit Registers
- 13.6 Million Whetstones/s(Single Precision) at 25 MHz
512-Byte On-Chip Instruction Cache
- Direct Mapped
- Parallel Load/Decode for Uncached Instructions
Multiple Register Sets
- Sixteen Global 32-Bit Registers
- Sixteen Local 32-Bit Registers
- Four Local Register Sets Stored On-Chip (Sixteen 32-Bit Registers per Set)
- Register Scoreboarding
On-Chip Memory Management Unit
- 4 Gbyte Virtual Address Space per Task
- 4 Kbyte Pages with Supervisor/User Protection
Built-in Interrupt Controller
- 32 Priority Levels
- 248 Vectors
- Supports M8259A
-3.4 s Latency @ 25 MHz
Easy to Use, High Bandwidth 32-Bit Bus
- 66.7 Mbytes/s Burst
- Up to 16 Bytes Transferred per Burst
Multitasking and Multiprocessor Support
- Automatic Task dispatching
- Prioritized Task Queues
Advanced Package Technology
- 132-Lead Ceramic Pin Grid Array