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74LCX821

Features: 5V tolerant inputs and outputs2.3V3.6V VCC specifications provided7.0 ns tPD max (VCC = 3.3V), 10 A ICC maxPower-down high impedance inputs and outputsSupports live insertion/withdrawal (Note 1)±24 mA output drive (VCC = 3.0V)Implements patented noise/EMI reduction circuitry Latch-up per...

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SeekIC No. : 004251035 Detail

74LCX821: Features: 5V tolerant inputs and outputs2.3V3.6V VCC specifications provided7.0 ns tPD max (VCC = 3.3V), 10 A ICC maxPower-down high impedance inputs and outputsSupports live insertion/withdrawal (N...

74LCX821 Data Sheet

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Part Number:
74LCX821
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

 5V tolerant inputs and outputs
 2.3V3.6V VCC specifications provided
 7.0 ns tPD max (VCC = 3.3V), 10 A ICC max
 Power-down high impedance inputs and outputs
 Supports live insertion/withdrawal (Note 1)
 ±24 mA output drive (VCC = 3.0V)
 Implements patented noise/EMI reduction circuitry
Latch-up performance exceeds 500 mA
 ESD performance:
    Human Body Model > 2000V
    Machine Model > 200V


Pinout

Connection Diagram


Specifications

Symbol Parameter Value Conditions Units
VCC Supply Voltage −0.5 to +7.0   V
VI DC Input Voltage −0.5 to +7.0   V
VO DC Output Voltage −0.5 to +7.0
−0.5 to VCC + 0.5

 Output in 3-STATE
Output in HIGH or LOW State (Note 3)

 V
IIK DC Input Diode Current −50 VI < GND mA
IOK DC Output Diode Current −50
+50

 VO < GND
VO > VCC

 mA
IO DC Output Source/Sink Current ±50   mA
ICC DC Supply Current per Supply Pin ±100   mA
IGND DC Ground Current per Ground Pin ±100   mA
TSTG Storage Temperature −65 to +150  



Description

The 74LCX821 consists of ten D-type Flip-Flops with 3-STATE outputs for bus organized system applications. The 74LCX821 is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment.

The 74LCX821 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation.




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