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74ACT241SC

Buffers & Line Drivers Octal Buf/Line Drv

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SeekIC No. : 00411782 Detail

74ACT241SC: Buffers & Line Drivers Octal Buf/Line Drv

74ACT241SC Data Sheet

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Part Number:
74ACT241SC
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Quick Details

Number of Input Lines : 8 Number of Output Lines : 3
Polarity : Non-Inverting Supply Voltage - Max : 5.5 V
Supply Voltage - Min : 4.5 V Maximum Operating Temperature : + 85 C
Mounting Style : SMD/SMT Package / Case : SOIC-20
Packaging : Tube    

Description

Polarity : Non-Inverting
Maximum Operating Temperature : + 85 C
Mounting Style : SMD/SMT
Number of Input Lines : 8
Supply Voltage - Max : 5.5 V
Supply Voltage - Min : 4.5 V
Number of Output Lines : 3
Packaging : Tube
Package / Case : SOIC-20


Features:

ICC and IOZ reduced by 50%
Non-inverting 3-STATE outputs drive bus lines or buffer memory address registers
Outputs source/sink 24 mA
ACT241 has TTL-compatible inputs


Pinout

Connection Diagram


Specifications

Supply Voltage (VCC).................. −0.5V to +7.0V
DC Input Diode Current (IIK)
    VI = −0.5V ......................................... −20 mA
    VI = VCC + 0.5V................................. +20 mA
DC Input Voltage (VI) .........−0.5V to VCC + 0.5V
DC Output Diode Current (IOK)
    VO = −0.5V........................................  −20 mA
    VO = VCC + 0.5V +20 mA
DC Output Voltage (VO) ......−0.5V to VCC + 0.5V
DC Output Source
    or Sink Current (IO)............................ ±50 mA
DC VCC or Ground Current
    per Output Pin (ICC or IGND)............... ±50 mA
Storage Temperature (TSTG)... −65°C to +150°C
Junction Temperature (TJ)
    PDIP ......................................................140°C


Description

The 74ACT241SC is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus-oriented transmitter or receiver which provides improved PC board density.




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