Features: Members of the Texas Instruments WidebusTM FamilyProvides Extra Data Width Necessary for Wider Address/Data Paths or Buses With ParityFlow-Through Architecture Optimizes PCB LayoutDistributed VCC and GND Pin Configuration Minimizes High-Speed Switching NoiseEPICTM (Enhanced-Performance I...
74AC16823: Features: Members of the Texas Instruments WidebusTM FamilyProvides Extra Data Width Necessary for Wider Address/Data Paths or Buses With ParityFlow-Through Architecture Optimizes PCB LayoutDistribu...
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Members of the Texas Instruments Widebus TM Family
Provides Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity
Flow-Through Architecture Optimizes PCB Layout
Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process
500-mA Typical Latch-Up Immunity at 125°C
Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings
These 18-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, parity bus interfacing, and working registers.
The 74AC16823 can be used as two 9-bit flip-flops or one 18-bit flip-flop. With the clock-enable (CLKEN) input low, the D-type flip-flops enter data on the low-to-high transitions of the clock. Taking CLKEN high disables the clock buffer, thus latching the outputs. Taking the clear (CLR) input low causes the Q outputs to go low independently of the clock.
The output enable (OE) input can be used to place the outputs in either a normal logic state (high or low) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.
OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
The 74AC16823 is packaged in TI's shrink small-outline package (DL), which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.
The 74AC16823 is characterized for operation over the full military temperature range of 55°C to 125°C. The 74AC16823 is characterized for operation from 40°C to 85°C.