74ABT827

Features: • Ideal where high speed, light loading, or increased fan-in are required• Flow through pinout architecture for microprocessor oriented applications• Output capability: +64mA/32mA• Slim 300 mil-wide plastic 24-pin package• Latch-up protection exceeds 500mA p...

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SeekIC No. : 004248767 Detail

74ABT827: Features: • Ideal where high speed, light loading, or increased fan-in are required• Flow through pinout architecture for microprocessor oriented applications• Output capability: +...

floor Price/Ceiling Price

Part Number:
74ABT827
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

• Ideal where high speed, light loading, or increased fan-in are required
• Flow through pinout architecture for microprocessor oriented applications
• Output capability: +64mA/32mA
• Slim 300 mil-wide plastic 24-pin package
• Latch-up protection exceeds 500mA per Jedec Std 17
• ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model
• Power-up 3-State
• Inputs are disabled during 3-State mode



Pinout

  Connection Diagram


Specifications

SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage   0.5 to 7.0 V
IIK DC input diode current VI < 0 18 mA
VI DC input voltage3     1.2 to 7.0 V
IOK DC output diode current VO < 0 50 mA
VOUT DC output voltage3 output in Off or High state 0.5 to 5.5 V
IOUT DC output current output in Low state 128 mA
Tstg Storage temperature range   65 to 150

NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.



Description

The 74ABT827 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive.

The 74ABT827 10-bit buffers provide high performance bus interface buffering for wide data/address paths or buses carrying parity. They have NOR Output Enables (OE0 , OE1) for maximum control flexibility.




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